Solidigm VP talks PCIe 6.0 SSDs, next-gen floating gate NAND, liquid cooled storage and more — Avi Shetty, VP of AI, Solutions & Market Enablement discusses the future of enterprise storage tech

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Solidigm is arguably one of the most mysterious storage companies in the industry today. The company is a wholly owned subsidiary of SK hynix, yet unlike its parent company, which produces charge-trap flash memory, it uses floating-gate 3D NAND memory that it develops and manufactures internally at a dedicated fab in Dalian, China.

Solidigm originates from Intel's Non-Volatile Memory Solutions Group (NSG), the company's NAND and SSD business unit, which used to have a unique technology strategy that differed from that of other flash and drive producers. To that end, it is not surprising that Solidigm also has a unique positioning as it only offers data center drives, most of which are based on floating-gate memory and proprietary in-house designed controllers. Furthermore, Solidigm is a fully vertically integrated company.

At Computex 2026, we sat down with Avi Shetty, who is vice president of AI ecosystem, Solutions & Market Enablement at Solidigm. Before his current position at Solidigm, he spent 14.5 years at Intel's storage division, so he has deep knowledge both about technology and the market. During our conversation, we discussed how Solidigm keeps evolving, including floating-gate NAND memory, advanced packaging technologies, next-generation SSDs, liquid-cooled SSDs, and more.

CTF NAND used by major memory makers has approached 276 - 286 active layers, whereas Solidigm's floating gate flash is still at 192 layers, meaning that the company is somewhat behind some of its rivals in terms of active layers as of mid-2026. It is set to catch up with its next generation that will have over 200 layers, but only in the second half of this year. However, floating gate NAND memory still has a number of advantages over CTF, particularly for applications that Solidigm targets.

Floating gate uses a conductive polysilicon island to store charge, which provides excellent cell isolation — charge stays well-contained and is less likely to spread to or interfere with neighboring cells — and this is particularly important for 3D QLC NAND with very high layer counts. In addition, Solidigm claims that floating gate gives a strong voltage threshold window and better cell isolation, which enables the company to keep scaling QLC more while maintaining good reliability.

Last year, we introduced what we believe was the world's first liquid-cooled storage solution for Nvidia environments. It used E1.S PCIe Gen5 SSDs with direct liquid cooling. Historically, liquid cooling was focused on CPUs and GPUs. We extended it to storage by allowing coolant to flow through a cold plate attached to the SSD. The cold plate removes heat directly from the drive. To fully exploit PCIe Gen6 performance, the ecosystem must develop those kinds of technologies as well.

It is also important to consider the broader market. Roughly 80% of storage capacity worldwide is still deployed on hard drives. PLC does not necessarily need to replace QLC on a one-to-one basis. Instead, it can create new opportunities where the advantages of solid-state storage — lower power consumption, higher density, smaller physical footprint, and lower total cost of ownership — become compelling.

What we are focused on is addressing the requirements emerging from Nvidia's Storage Next initiative. The fundamental challenge is bandwidth. HBM is extremely fast, but it is also expensive and difficult to scale economically. As AI systems continue to grow, the industry needs additional memory and storage tiers that provide greater capacity at lower cost. That creates demand for NAND-based solutions that remain non-volatile while delivering improved latency and bandwidth characteristics.